Hello,
I have many years design experience in various applications. I have designed embedded analyzers, conveyor controllers, autodialers and others. I can handle high-speed communications (CameraLink, USB3, USB2, BLVDS), high-precision anlog (18bit ~ 24bit), high voltage (>1500VDC), high-power (>300W), galvanically isolated designs, IP65, harsh environments, distributed controls and others.
Please feel free to look through my portflio. I use Eagle 6.5 for schematic and layouts, LTSpice for simulation. I can also provide designs for enclosures or mechanical parts using AutoCAD (3D in MDT).
I can provide design support and firmware for many MCU's and Xilinx FPGAs.
This is a very ambitious project as you probably know, involving wearable power sources and thermal heat exchange design. Heating alone would be easy, but the cooling will be very power hungry and potentially be heavy (maybe even noisy if fans are required to remove the heat). Have you built any prototypes of the thermal exchange device?
Let me know if I can be of assistance.
Best regards,
Stuart Borden.